Dear Tanaka Lab’s student blog reader,
This is Salman, an M2 student who have stayed at Fraunhofer ENAS in Germany for the past 5 months. Here I would like to report about the so called Chemnitzer Seminar 2017, which was held just before my departure back to Japan.
On 13-14 June 2017, I had a chance to attend the Chemnitzer Seminar in Fraunhofer ENAS, Chemnitz, Germany. This seminar is held annually as an exchange meeting between Fraunhofer ENAS, or in particular its Department System Packaging, and its collaborators. This year, Tanaka-sensei is one of the speakers, as the collaboration between Fraunhofer ENAS and Tohoku University has a long history.
The seminar starts at noon on 13th. It was opened by an opening speech by Dr. Maik Wiemer, the head of the Department System Packaging. He introduced the activities in the department, highlighting the achievement in during the past one year. He also introduced the Fraunhofer Project Center, which is a group within our laboratory under Froemel-sensei, in Sendai and its activities.
Chemnitzer Seminar 2017 opening remarks by Dr. Maik Wiemer.
The second speech was from Tanaka-sensei. He introduced research activities in our laboratory, highlighting the MEMS application for robotics development. Tactile sensor system and its large scale integration (LSI) sensor platform is offered as a solution for a high density sensor distribution for robots, which potentially leads to the higher level of human-robot interaction. A high performance whole angle gyroscope is also offered as a solution for the stability of robot movement.
Tanaka-sensei introduced our lab at the end of his presentation.
The focus of the Chemnitzer Seminar is in the current development of packaging technologies. It covers a wide area from the development of functional materials, deposition technologies, additive manufacturings, bonding technologies, trough silicon vias (TSV) and their applications for various purpose. From this seminar, I could get many insights, not only about the development of the technologies, but also some technical knowledge.
For instance, in a presentation by Dr. Anke Sanz-Velasco, IMT AG (Switzerland), I got to know about advanced glass processing techniques, especially glass patterning using oxygen rich Cr and HF dry etching. In another presentation by Mr. Hubner from Leibniz-institut (Germany), a technology to reduce the electron beam writing time with variable shaped beam is proposed. In his proposal, his team has demonstrated a time reduction from several years to several hours in an attempt to pattern a complicated design.
A trend of smart system for agricultural sector is also proposed by Dr. Woodhead from Lincoln Agritech (New Zealand). His proposal also included a call for collaboration to commercialize their work. It was very interesting to know that it is also possible to monitor the amount of N2 fertilized as well as soil moisture level to achieve a smarter irrigation system. These functions are realized by microwave sensor they developed.
There was also a presentation from Mr. Frank Roscher. He is one of two group leaders in the Department System Packaging of Fraunhofer ENAS who has received the Fraunhofer awards for his achievement in research as well as customer relation. I am actually working under his group during my stay. His main research interest is about the development of functional materials for microsystem packaging. And in this seminar, he introduced his work on the development of an aerosol jet printing technology to realize a 3D film membrane package. The package has a function as a security protection. When something penetrates the membrane, the security system will work, that the confidential data are kept safe.
Finally, the first day was closed by the presentation from Prof. Schulz about ongoing project in ENAS. The project is about a transportation card, which now is normally using the tap in tap out method. A new system which does not require tapping is proposed. The challenges are that everything, including sensors, actuators and power supply, have to be placed in a thin chip.
The second day starts from the morning with several presentations on the biomedical appications of smart systems. Biomedical equipments are often bulky and expensive, thus, only good hospitals have such facility. However, the idea of smart system using microsensors has fostered the idea of the development of wearables, or even implantable equipments. To realize that purpose, many researchers are working together. Of the devices developed are ultrasound assisted micro-endoscopy for diagnostic and therapeutics inside the human body by Fraunhofer ENAS, a wearable electroencephalogram (EEG) device developed by eemagine (Germany), and an optical sensor developed by Shinko (Japan).
There is coffee break for the participants and presenters to exchange ideas or build a network in the middle of each session.
Overall, I think it was a good opportunity for exchanging results, as well as opening new collaborations between institutes from various countries. For me, it was also another exposure to new technologies being developed around the world. The seminar has given me a new perspective of what kind of world that we are going to realize with the development of technology, in particular the smart systems’ approach.
I'm Shao Chenzhong, a D2 student.
On March 14, 2017, I went to Toyama University to join the IEEJ 2017 conference. After about 4 hours’ trip by Shinkansen, I arrived at my hotel near Toyama station at 5 pm.
At 5 pm, the sky was still bright and the weather was good. So, I took out my sport clothing and went jogging. My plan was running to the Gofuku Campus of Toyama University, checking the conference place and running back to my hotel. I am always afraid of getting lost in a university.
Along the way, I saw a lot of scenery,
beautiful Toyama Castle beside a lake,
and Toyama bridge.
I also saw the streetcar which is one of the characteristics of Toyama.
After a while, I reached the Gofuku Campus and saw the guide board for IEEJ 2017.
After checking the conference place, fortunately, it was easy to find, I run back to my hotel. Took a shower, ate noodles, watched TV, prepared my presentation and then went to bed.
Nice view, tired trip and good sleep.
The first day of the conference was nothing special. I listened to many presentations. Most of presentations were in Japanese. Thanks to my CASIO electronic dictionary, I can understand part of the contents.
On the second day, there were some special speeches including a speech about PlayStation VR. Although I forgot what the speaker talked about PlayStation VR, after listening to this speech, I planned to buy one. The following shows some pictures near the special speech place.
(Toyama Castle again)
On the evening of the second day, we had a social gathering meeting (懇親会). In this meeting, I met Muroyama-sensei and Nonomura-sensei, saw some wonderful Toyama special programs and ate a lot. The next day was my turn to make a presentation, so I needed a good sleep, but it was hard (I was nervous).
At 4: 30 pm the third day, finally, I finished my presentation. The speaking time was OK. I answered two questions, one from Nonomura-sensei and one from a person of Tohoku Electric Power. Thanks to the translation of Muroyama-sensei, I think the question session was also OK.
At 5 pm, the IEEJ 2017 conference ended. Then I went to eat the famous black ramen (noodles). It was delicious, but salty. I doubt the black soup was soy sauce.
After eating, I took the Shinkansen to go back. When I arrived at Sendai, it was almost 11 pm. That night I slept very well.
This three days’ conference gave me a wide view about electrical researches. And Toyama is a beautiful place to visit. If you have time, I suggest you to taste the black ramen of Toyama.
Dear Tanaka Lab’s student blog reader,
guten tag aus Deutschland!
This is Salman, an M1 student currently visiting Fraunhofer ENAS in Germany. Although I am in Germany, this time I would like to write about another thing, that is my experience in collaborating with another laboratory in Tohoku University.
Since April 2016, I am enrolled as a student of the Inter-Graduate School Doctoral Degree Program on Science for Global Safety (G-Safety), Leading Graduate School Program. This program requires me and the other enrolled students to perform a project with the other laboratory, which is called Convergence Laboratory Training (C-Lab). The project can also actually be found in Mechanical Engineering division under the title of Frontier of Mechanical Engineering (機械工学フロンティア). In this project, I actually joined 2 programs, but I will report only one here, with relation to our laboratory.
I joined a project with Miura Laboratory’s students. We started the project in May 2016 by discussing about what we will do. Compared to Miura Lab, our laboratory is very strong in sample fabrication, because to make a single MEMS (or even to demonstrate a single packaging technology), we need to undergo a long fabrication process, which consists of various processes. And often we found some failure in our process which makes us have to redo the processes. This trial and error process taught us how the real micro-fabrication process is.
On the other hand, compared to our lab, Miura Lab is very strong in the evaluation technology for materials. Their typical research is to deposit a material using a specific technology, and evaluate various properties in correspondence with different deposition parameters. Every student in Miura Lab masters an evaluation technology deeply.
We finally decided to study the property of electroplated gold (Au), since gold has never been studied in Miura Lab, and used it as a material for MEMS packaging in my research. Then we evaluate it using the specialties of each 4 Miura Lab’s student.
This was a good collaboration since I have no any basic about the evaluation technology for thin-film properties before (which they are very strong). And they didn’t know anything about Au electroplating. So all of us learn a lot from this project.
So after doing Au electroplating and apply some annealing variation, we evaluated the film using nano-indentation test, electron backscatter diffraction (EBSD) and micro-tensile test. I learned from the basics of these evaluation methods and see the real experiments. I performed the real experiments only for the EBSD.
Nano-indentation test and EBSD are conventional technologies, which is actually used by almost all materials researcher. Nano-indentation test is used to measure the Young’s modulus and hardness of a thin film and EBSD is used to evaluate the crystal orientation and size on a surface of a material. However, the micro-tensile test is a novel technology. It is used to evaluate the strength of grain or grain boundary. In my opinion, although the principle does not looks so complicated, the fabrication of the test sample is very difficult. Everything is put inside a focused ion beam (FIB) machine and patterned using ion beams. Quite unbelievable. Even the test itself is done inside the FIB machine and takes around 1 full day for 1 sample making until the test (all inside the same FIB machine), regardless it is successful or not.
Finally I used some of the knowledge obtained from this training for my research. That is using EBSD to analyze the grain boundary of the surface resulted by the fly-cutting process, and presented the result in an international workshop.
The international workshop is titled the 2nd USTB-TU Joint Workshop on Advanced Materials and Manufacture, held at the University of Science and Technology Beijing (USTB), China, on 21-24 February 2017. It is a joint workshop by the Fracture and Reliability Research Institute of Tohoku University and the Collaborative Innovation Center of Steel Technology of the USTB. The workshop is done for both fostering the collaboration between 2 institutes, as well as to give students an opportunity to practice giving presentation in an international environment. Each student was given a slot for oral presentation as well as poster session. Maybe it is also good to have such kind of joint workshop in our lab for practice. In this workshop, I was surprised that the students from Miura Lab are B4 students. They have been given such good opportunity from a very young age.
For me, it was a practice in giving presentation to people from different background and research interest. As you may guess from the title of the workshop, the main interest of the people there is the materials and manufacturing technologies. I think there were only a few people in the workshop who has ever heard about the term “MEMS” before. So I need to somehow modify my talk. And I also learned a lot about evaluation technologies for material properties.
Here I would like to share some photos:
A typical road on a typical day in Beijing. The sky in Beijing is not blue due to the high amount of pollution mainly from industries and transportation. Let us protect our environment!
But fortunately the sky was blue during the day for excursion! As one of the destination, we visited the Palace Museum. Chinese students must know who this guy in the photo is!
The roof of the temple is very artistic!
Before ending this post, I would like to thank the G-Safety program, which made this collaboration possible. I would also acknowledge Tanaka-sensei and Hirano-sensei for their guidance in my research. Also thanks to Kaneko-san for introducing me to this G-Safety program. Then the last but not the least, I would like to thank Miura-sensei and his lab members who have provided me the opportunity to learn something new.
And finally I would like to close this post with a quote:
“For young researchers, don’t be too focused on your field. You should read other field’s literature, hear and discuss with other field’s researchers. Maybe the idea will come from other fields.”
- Prof. Jean-Pierre Sauvage -
(Nobel Laureate in Chemistry 2016)
at the Nobel Prize Dialogue Tokyo 2017: The Future of Intelligence
I’m Koki Tanaka, a D3 student. I’m going to leave Tohoku University in next March.
Today, we have a greeting and wonderful sweets from Vogel-san, Germany.
He had stayed S. Tanaka laboratory several years ago, as a researcher from Fraunhofer ENAS.
A letter and Germany sweets from Vogel-san!!
We are very happy to receive the greeting and sweets from you.
How is your life and researching? We hope everything is going well.
Shao-san with the sweets. He looks very happy, good smile.
In this period, it seems that some students are quite busy.
In contrast, I’m not so nervous, because my final-defense had already finished.
Kaneko-kun (left-side) and Asano-kun (right-side). Both are doctoral student, so quite busy now. However, they will be relaxed by the sweets...
Some other students are preparing the farewell party.
We have been given some hand-made gifts for graduates.
Teranishi-kun. It seems that he is polishing something for the gifts, even though he has to make a bachelor’s thesis... Thanks!
Above is current situation of S. Tanaka laboratory.
I’d like to upload this article as a greeting from Japan!