Hello everyone, this is Sun Tong, a M2 student.
The SEMICON JAPAN 2016 was held in Tokyo Big Sight on 14-16 December, Tokyo. It is one of the largest international exhibition of semiconductor industry in the world. As an exhibitor, Tanaka Lab had a booth in the World of IOT (Internet of Thing) area, which was prepared by staffs. Besides staffs, six students from our lab also got the great opportunity to attend this event on 14 Dec, including Shao-san(D2), Nishino-san (D1), Kaneko-san(D1), salman-san(M1), Morimura-san(B4) and me. Tokyo Big Sight
Our student group got together in Sendai Station at around 7am and took the Yamabiko train to the Tokyo. We arrived at Tokyo Big Sight at about 10 am. The SEMICON already started and crowds of people was flowing into the site. Following with people stream, we entered the site.
The exhibition area was mainly separated into 2 parts: Front-end Process Zone and Back-end/Materials & Overall Process Zone. More than 600 high-level industrial companies and laboratories from all over the world gathered there. Bringing their latest technologies and productions, they made presentations and demonstrations to attract potential collaborators. Apart from that, several small but special zones were also set in this exhibition such as World of IOT zone which focused on IOT system/solution and Mirai College Corner which provided a communication platform for job hunting students and companies.
It was the first time for me to attend such a big scale industrial fair and it broadened my horizon. Those latest technologies and productions really impressed me. Hitachi exhibited their NEXTAGE, which is a humanoid dual arm industrial robot. 4 cameras and image recognition technique help it to recognize surroundings and positions in 3D so that it can work next to people. Toyota exhibited their latest FCV (fuel cell vehicle) Mirai. Comparing to internal-combustion engine, the eco-car has higher energy conversion efficiency. And what’s more, it uses Oxygen and Hydrogen as fuel so that no exhaust gas will be generated.
Tanaka Lab’s booth was located in World of IOT corner, which was managed by Takoshima-san. Several posters showed Tanaka Lab’s research fields and achievements to visitors. And Hirano-sensei gave a great seminar titled “Wafer-level heterogeneous integration using metal bonding based technology” in STS MEMS/Sensor Session at TechSTAGE INNOVATION&IOT area.Takoshima-san was introducing Tanaka Lab to the president of Sumitomo Precision Products Co., Ltd.Group photo of students
And finally, we would like to thank our sponsor, SEMICON Mirai-College, who has provided we return travel expenses from Sendai to Tokyo.